UNINET RELEASES NEW X-TRA SLIM BOARD® TECHNOLOGY CHIPS
 UniNet announces a new patent pending chip manufacturing process called X-Tra Slim Board® Technology. Joe Cachia, General Manager of UniNet’s Chip Manufacturing Division, explains that through a unique build process, add-on boards (repair chips) can be applied directly over existing OEM chips. This build process results in an ultra-thin chip assembly. In tight situations, this unique design allows chip installation without interfering with the normal machine function.
Joe comments, “In some cartridge applications, it is impossible to replace the cartridge chip without destroying the cartridge. In addition, there is very little room to add a daughter or “add-on” board over the OEM chip. In these tight situations, the add-on chip may prevent cartridges from fully engaging into the printer. This causes unpleasant toner leaks, undesirable gear noise or clicking, and premature wear on printer gears.”
Features of this new process include:
Mounting of components in an inverted position (upside down), using precision cut holes in the circuit board to accommodate the main body of the components, and components that are still soldered directly to the circuit board using the upper surface of leads rather than the bottom surface.
Outlined benefits of this process include:
• Ultra-Thin Assembly
• Allowed Installation in Tight Applications
• Non-Interference with Cartridge Installation or Door Closing
• Elimination of Toner Leaks, Gear Noise/Clicking and Wear on Printer Gears
SAMSUNG CLP 300 CHIPS
UniNet now introduces its very first line of USA Region X-Tra Slim Board® Technology Chips, qualified for use in Samsung® CLP 300 toner cartridges, rated 2,000 pages (CMYK) at 5% coverage.
XEROX® PHASER 6110 CHIPS
UniNet also introduces USA Region X-Tra Slim Board® Technology Chips, qualified for use in Xerox® Phaser 6110 toner cartridges, rated 2,000 (Black) and 1,000 pages (CMY) at 5% coverage. |
